INFORMATION RESEARCH

Identification and Path Analysis of Key Core Technologies Integrated CFDP and CPM Analysis: A Case Study of Chip Lithography

  • Lü Kun ,
  • Luo Xingyu ,
  • Jing Jipeng
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  • 1 Business School, Ningbo University, Ningbo 315211;
    2 School of Information Management, Central China Normal University, Wuhan 430079;
    3 School of Business and Management, Jilin University, Changchun 130012

Received date: 2023-12-15

  Revised date: 2024-02-29

  Online published: 2024-08-24

Supported by

This work is supported by the youth project of National Social Science Fund of China titled “Research on the Construction and Co-evolution of an Innovation Ecosystem with ‘Technology-Economy-Region’ Information Integration under the ‘Dual Carbon’ Goal” (Grant No. 22CTQ028).

Abstract

[Purpose/Significance] Constructing an innovative and multi-layered key core technology research system helps seize the initiative in technological development and grasp crucial opportunities for technological breakthroughs. [Method/Process] This paper adopted the Word2Vec model for text vectorization and utilized the CFDP algorithm to identify core technologies. It employed structural hole analysis to recognize key core technologies and constructed a patent citation network. The Critical Path Method (CPM) was applied to explore the significant pathways of technological development, presenting a systematic method for key core technology research. [Result/Conclusion] Using chip lithography as a case study, this paper validates the feasibility of the proposed method system in the identification and path analysis of key core technologies. Through the examination of existing national policies, the empirical results are found to be reasonable, further confirming the practicality and effectiveness of the method system.

Cite this article

Lü Kun , Luo Xingyu , Jing Jipeng . Identification and Path Analysis of Key Core Technologies Integrated CFDP and CPM Analysis: A Case Study of Chip Lithography[J]. Library and Information Service, 2024 , 68(16) : 75 -89 . DOI: 10.13266/j.issn.0252-3116.2024.16.007

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